Improvement on QFN Leadframe Design of Extended Leads to Support the Mitigation of Mold Flash Occurrence

Parameter optimization is not only the key to find the most favorable and best solution as variable chances of failure modes may happen at extreme case conditions at unexpected period. Packaging design robustness is much resilient to establish a satisfactorily good quality product and sustain a long-term goal of a remarkable process capability. This paper presents leadframe design solution of quad-flat no leads (QFN) to address mold flash defect caused by leadframe bouncing during wirebonding. An inverted pyramid configuration was conceptualized to provide better stability than the standard configuration during wirebonding process and other concerned assembly processes due to the shift of the center of gravity moving closer to the full metal part.